Revolutionizing Chip Manufacturing: Breakthroughs in 3D X-ray Imaging and Extreme Ultraviolet Lithography

Revolutionizing Chip Manufacturing: Breakthroughs in 3D X-ray Imaging and Extreme Ultraviolet Lithography In the realm of semiconductor manufacturing, ensuring the integrity and precision of computer chips is paramount. A recent breakthrough by researchers at the Paul Scherrer Institute (PSI) in Switzerland and the USC Viterbi School of Engineering has introduced a novel technique to non-destructively […]